Leadframe-based semiconductor package for multi-media card

Details Leadframe-based semiconductor package for multi-media card Leadframe-based semiconductor package for multi-media card

2005-03-01

2005-03-01

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S670000, C257S787000

Reexamination Certificate

active

06861736

ABSTRACT:
A leadframe-based semiconductor package is proposed for the packaging of a semiconductor device, such as a multi-media card (MMC) chipset. The proposed semiconductor package is characterized by the use of a leadframe, rather than BT substrate or film, as the chip carrier for MMC chipset. The leadframe includes a supporting bar; a chip-supporting structure arranged at a downset position in relation to the supporting bar; and a plurality of leads, each lead including an outer-lead portion and an inner-lead portion; wherein the outer-lead portion is levelly linked to the supporting bar, while the inner-lead portion is arranged beside the chip-supporting structure and linked to the outer-lead portion via an intermediate-lead portion. The leadframe can be either the type having die pad or the type having no die pad. In the case of the type having die pad, a semiconductor chip is mounted on the die pad; and in the case of the type having no die pad, one or more semiconductor chips are mounted over an elongated part of the inner-lead portions of the leads. The use of leadframe allows the MMC package to be manufactured without having to include a lidding process, so that the MMC manufacture can be carried out in a less complex and more cost-effective manner.

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