Leadframe-based housing, leadframe strip, surface-mounted...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Reexamination Certificate

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Details

C257S680000, C257S687000, C438S123000, C438S124000, C438S116000

Reexamination Certificate

active

07102213

ABSTRACT:
A leadframe-based housing for a surface-mountable component, particularly a radiation-emitting component. The leadframe-based housing comprises electrical connector strips and at least one chip mounting area. One of the connector strips includes an injection aperture that enables a leadframe-based housing to be produced with a very small thickness in an injection molding process. A method for producing such housings is further specified.

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patent: 11-340403 (1999-12-01), None
patent: WO 03/019677 (2003-03-01), None

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