Leadframe assembly for conducting thermal energy from a semicond

Details Leadframe assembly for conducting thermal energy from a semicond Leadframe assembly for conducting thermal energy from a semicond

1995-06-05

1999-03-23

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257675, 257712, 438122, H01L 23495

Patent

active

058863966

ABSTRACT:
A semiconductor die (32) is disposed on a heat sink (22) in an electronic package (10). During assembly, a leadframe (20) is connected to the heat sink (22) by down-set tabs (14, 28), which are offset from the heat sink (22) and disposed within the boundary (19) in which the final package (10) will be molded. Individual heat sinks (22) are pre-out prior to molding the final packages (10). In one roach, pins (36) are used to connect down-set tabs (14, 28) to heat sink (22).

REFERENCES:
patent: 3423516 (1969-01-01), Segerson
patent: 3574815 (1971-04-01), Segerson
patent: 3766977 (1973-10-01), Pravda et al.
patent: 3899305 (1975-08-01), Hilgers et al.
patent: 4012768 (1977-03-01), Kirk et al.
patent: 4661887 (1987-04-01), Lin
patent: 4807018 (1989-02-01), Cellai
patent: 5384286 (1995-01-01), Hirai
patent: 5430331 (1995-07-01), Hamzehdoost et al.

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