Leadframe and resin-sealed semiconductor device

Details Leadframe and resin-sealed semiconductor device Leadframe and resin-sealed semiconductor device

1992-09-16

1994-11-22

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257787, H01L 2348

Patent

active

053671910

ABSTRACT:
A lead frame body having a chip mounting surface comprises first, second and third successive, laminated layers each having lower and upper surface, the lower main surface of the first layer defining a bottom main surface of the lead frame body and the upper main surface of the third layer defining the chip-mounting surface of the lead frame body. The first, second and third layers are formed of respective, different materials, the material of the second layer having a higher etching rate than the respective etching rate of the materials of the first and third layers. A plurality of spaced openings are formed in the first layer and which respectively correspond to and are in communication with a corresponding plurality of spaced hollow cavities in the second layer. The interior dimensions of the hollow cavities are greater than the corresponding interior dimensions of the respective openings, producing an annular lip of the material of the first layer at each opening which extends inwardly relatively to the respective hollow cavity.

REFERENCES:
patent: 4942452 (1990-07-01), Kitano et al.
patent: 5221428 (1993-06-01), Ohsawa et al.
Patent Abstracts of Japan, vol. 13, No. 18 (E-704) Jan. 17, 1989 & JP-A-63 224245 (Hitachi Ltd) Sep. 19, 1988.
Patent Abstracts of Japan, vol. 14, No. 51 (E-881) Jan. 30, 1990 & JP-A-1 278055 (Shinko Electric Ind Co Ltd) Nov. 8, 1989.
Patent Abstracts of Japan, vol. 14, No. 568 (E-1014) Dec. 18, 1990 & JP-A-2 246359 (Fujitsu Ltd) Oct. 2, 1990.
Patent Abstracts of Japan, vol. 15, No. 139 (E-1053) Apr. 9, 1991 & JP-A-3 018048 (Matsushita Electron Corp) Jan. 25, 1991.
Patent Abstracts of Japan, vol. 15, No. 394 (E-1119) Oct. 7, 1991 & JP-A-3 159163 (Shinko Electric Ind Co Ltd) Jul. 9, 1991.
Patent Abstracts of Japan, vol. 15, No. 248 (E-1128) Oct. 30, 1991 & JP-A-3 179768 (Hitachi Metals Ltd) Aug. 5, 1991.
Patent Abstracts of Japan, vol. 15, No. 444 (E-1132) Nov. 12, 1991 & JP-A-3 188658 (Toppan Printing Co Ltd) Aug. 16, 1991.

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