Leadframe and resin-sealed semiconductor device

Details Leadframe and resin-sealed semiconductor device Leadframe and resin-sealed semiconductor device

1994-09-30

1998-05-19

Graybill, David

Fishing, trapping, and vermin destroying

437220, H01L 2148, H01L 2156, H01L 2160

Patent

active

057535353

ABSTRACT:
Process for manufacturing a leadframe that is adapted to enhance the adhesion between a stage 1 and a sealing resin without decreasing the bonding strength between the stage 1 and a chip 4; and a semiconductor device constructed by using such a leadframe. The leadframe comprises a body 1 constructed from at least two kinds of layer members, 11, 12, and 13, formed from different materials and laminated one on top of the other; the materials for the layer members 11, 12, and 13 being chosen to have different etching rates. Hollow spaces 15 are formed inside the layer member having the greatest etching rate of all the layer members.

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