Leadframe and packaged light emitting diode

Details Leadframe and packaged light emitting diode Leadframe and packaged light emitting diode

2008-04-22

2008-04-22

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S098000, C257S100000, C257S675000, C257SE33058, C257SE33075

Reexamination Certificate

active

11178144

ABSTRACT:
A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.

REFERENCES:
patent: 5958100 (1999-09-01), Farnworth et al.
patent: 6274924 (2001-08-01), Carey et al.
patent: 6517218 (2003-02-01), Hochstein
patent: 7075114 (2006-07-01), Abe et al.
patent: 2001/0030866 (2001-10-01), Hochstein
patent: 2004/0041222 (2004-03-01), Loh
patent: 2004/0126913 (2004-07-01), Loh
patent: 2006/0012299 (2006-01-01), Suehiro et al.
patent: 2006/0103012 (2006-05-01), Chin

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