Leadframe and method for removing cleaning compound flash...

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

Reexamination Certificate

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Details

C257S666000, C425S129100, C425S812000

Reexamination Certificate

active

07029256

ABSTRACT:
An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.

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