Leadframe and a method of manufacturing a semiconductor device b

Details Leadframe and a method of manufacturing a semiconductor device b Leadframe and a method of manufacturing a semiconductor device b

1998-03-19

2000-08-22

Picardat, Kevin M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257670, 257674, 438111, H01L 23495

Patent

active

061076767

ABSTRACT:
A leadframe and a method of manufacturing a semiconductor device make it possible to manufacture easily and efficiently such small-size semiconductor devices as have many leads but rarely suffer from short circuits between the leads when mounted on a circuit board. To achieve this, in a leadframe having a plurality of leads, an island for mounting a semiconductor chip, and a tie-bar for joining the leads together, the leads are given bends at their intermediate positions so that the pitch with which they are arranged is greater in a region farther from the island than in a region closer thereto, and the tie-bar is formed between those bends and the island. After the semiconductor chip mounted on the island, together with the portion surrounding it, is sealed in in a resin mold, those portions of the tie-bar which come between the leads are removed by cutting them apart parallel to the side edges of the leads. A projection is formed in a side edge of the island, and this projection is pressed against the stage during wire-bonding.

REFERENCES:
patent: 4701781 (1987-10-01), Sankhagowit
patent: 5321305 (1994-06-01), Sakamoto
patent: 5517056 (1996-05-01), Bigler et al.
patent: 5729049 (1998-03-01), Corisis et al.

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