Leadframe adapted to support semiconductor elements

Details Leadframe adapted to support semiconductor elements Leadframe adapted to support semiconductor elements

1994-02-04

1995-02-21

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Having marginal feature for indexing or weakened portion for...

428600, 257666, H01L 23495

Patent

active

053914392

ABSTRACT:
In a leadframe for supporting semiconductor devices and including a plurality of outer lead sections, a recess or recesses are provided on each of the outer lead sections at a central portion or both sides of each outer lead section in a region including a cutting line. The recess or recesses reduce the cross-sectional area of the lead section, thus enabling a new cut surface of the lead section to be well covered by solder and enabling ready cutting of the lead section.

REFERENCES:
patent: 3569797 (1971-03-01), Simmons
patent: 4283839 (1981-08-01), Gursky
patent: 4380042 (1983-04-01), Angelucci et al.
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 5029386 (1991-07-01), Chao et al.

Affiliated with

Also associated with

Rating

Leadframe adapted to support semiconductor elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe adapted to support semiconductor elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe adapted to support semiconductor elements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1928909