Electricity: electrical systems and devices – Miscellaneous
Patent
1987-11-17
1988-10-11
Pellinen, A. D.
Electricity: electrical systems and devices
Miscellaneous
357 68, 361408, H01R 900
Patent
active
047775645
ABSTRACT:
An improved leadform for use with surface mount components is described. The improved leadform provides a connection to a printed circuit substrate which is highly resistant to stress related failures. The leadform is configured so that the connection utilizes a relatively greater area of the leadform for contact with a solder connection resulting in a more compliant connection. In addition, the present invention provides a preparation for the printed circuit media which allows the substrate media to absorb stresses which occur due to thermal cycling.
REFERENCES:
patent: 2757319 (1956-07-01), Kapp
patent: 2962396 (1960-11-01), Pankove
patent: 3062991 (1962-11-01), Kaidan
patent: 3308526 (1967-03-01), Jellig
patent: 3693052 (1972-09-01), Galanti
patent: 3745513 (1973-07-01), Gross
patent: 3750252 (1973-08-01), Landmann
patent: 3796921 (1974-03-01), Fischer
patent: 3818279 (1974-06-01), Seeger, Jr. et al.
patent: 3846743 (1974-11-01), Garver
patent: 3848207 (1974-11-01), Bussey et al.
patent: 3984166 (1976-08-01), Hutchison
patent: 4015707 (1977-04-01), Kisor
patent: 4080485 (1978-03-01), Bonkohara
patent: 4086426 (1978-04-01), Knappenberger
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4184043 (1980-01-01), Hildering
patent: 4187388 (1980-02-01), Roberts
patent: 4326239 (1982-04-01), Ohsawa et al.
patent: 4339303 (1982-07-01), Frisch et al.
Richard Lay, "A-B To Offer J-SOIC Packages," Electronic Engineering Times, 3/26/84, p. 64.
Jeffrey Shepard, "Component Comments", Electronic Engineering Times, 4/9/84.
Baxter Emery E.
Ceccoli Joseph D.
Derfiny Dennis J.
Hackbart Rolland R.
Jenski Raymond A.
Motorola Inc.
Pellinen A. D.
Thompson Gregory D.
LandOfFree
Leadform for use with surface mounted components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Leadform for use with surface mounted components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadform for use with surface mounted components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1961591