Leaded semiconductor package having temperature controlled lead

Details Leaded semiconductor package having temperature controlled lead Leaded semiconductor package having temperature controlled lead

1994-06-30

1995-10-03

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Temperature

257666, 257696, 257747, 257750, 257762, 257766, H01L 2941, H01L 2943

Patent

active

054554462

ABSTRACT:
A plastic leaded semiconductor package (20) has a semiconductor device (614) encapsulated in the package and mounted to a lead frame (612). The lead frame has a plurality of leads (622) that extend beyond the body (610) of the encapsulated package. Each of the plurality of leads is made from a metal having a predetermined coefficient of thermal expansion. A second metal (627) with a different coefficient of thermal expansion is disposed on at least one portion of each of the leads.

REFERENCES:
patent: 4673967 (1987-06-01), Hingorany
patent: 5041901 (1991-08-01), Kitano et al.
patent: 5329158 (1994-07-01), Lin
patent: 5360991 (1994-11-01), Abys et al.
Semiconductor International, May 1994, "Ultrathin Packages: Are They Ahead of Their Time?", pp. 48-52.

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