Leaded grid array IC package having coplanar bent leads for surf

Details Leaded grid array IC package having coplanar bent leads for surf Leaded grid array IC package having coplanar bent leads for surf

1997-05-29

2000-01-25

Larson, Lowell A.

Wireworking

Article making or forming

Electric lamp or electric space discharge device electrode

140105, B21F 4500

Patent

active

060168528

ABSTRACT:
An integrated circuit package with a two dimensional array of leads that each have a foot portion which is bent at an angle relative to a vertical column portion of the leads. The foot portion of the leads are typically soldered to the surface pads of a printed circuit board. The leads are formed by a tooling apparatus which has a bending device that bends the foot portions of the leads onto a bending die. The tooling apparatus insures that the foot portions of the leads are all coplanar with the printed circuit board.

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patent: 5541449 (1996-07-01), Crane, Jr. et al.
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