Lead type chip capacitor and process for producing the same

Details Lead type chip capacitor and process for producing the same Lead type chip capacitor and process for producing the same

1989-07-25

1991-04-09

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361321, H01G 114

Patent

active

050069535

ABSTRACT:
A lead type chip capacitor which is disclosed herein comprises a capacitor chip having a lead terminal bonded thereto through a joining or bonding layer made of a highly melting metal paste. The lead type chip capacitor is produced by bonding at least one internal electrode in a capacitor chip with a lead terminal by a metal paste, drying them at a temperature in a range of 100.degree. to 200.degree. C., and firing the resulting capacitor chip with the lead terminal bonded thereto at a temperature in a range of 500.degree. to 900.degree. C. in the air or in a nitrogen atmosphere.

REFERENCES:
patent: 3515958 (1970-06-01), Claypoole et al.
patent: 3612963 (1971-10-01), Piper et al.
patent: 4151579 (1979-04-01), Stark
patent: 4158218 (1979-06-01), McLaurin et al.
patent: 4571276 (1986-02-01), Akse
patent: 4701827 (1987-10-01), Fujikawa et al.

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