Lead tinning system

Metal fusion bonding – Combined

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 37, B23K 108, B23K 112

Patent

active

045963533

ABSTRACT:
Apparatus for treating electronic components comprises a frame, a lower track mounted on the frame for supporting the components, and an upper track mounted on the frame in a normal operating position above and in spaced-apart parallel relationship to the lower track. The lower and upper tracks define therebetween a path along which the components can pass for treatment. Pusher fingers are provided each having a portion which extends substantially horizontally in such a manner as to be insertable between the tracks and engageable with individual ones of the components. A drive is mounted on the frame for propelling the fingers. The components are held captive between the lower and upper tracks, and the fingers engage individual ones of the components and propel them along the path.

REFERENCES:
patent: 3482755 (1969-12-01), Raciti
patent: 3595374 (1971-07-01), Whitfield
patent: 3765591 (1973-10-01), Cook
patent: 3825994 (1974-07-01), Coleman
patent: 4018327 (1977-04-01), Goodman et al.
patent: 4246840 (1981-01-01), Yoshino et al.
patent: 4250988 (1981-02-01), Miaskoff

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lead tinning system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead tinning system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead tinning system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2082191

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.