Lead plating method for GMR head manufacture

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S603070, C029S603150, C029S603160, C029S603180, C205S119000, C205S122000, C360S234100, C360S324110, C360S324120, C360S324200, C427S127000, C427S128000, C438S369000, C438S396000, C438S706000, C438S720000, C438S722000, C451S005000, C451S041000

Reexamination Certificate

active

07111386

ABSTRACT:
A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

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Nakamoto et al.,“Read-Write Performance of GMR Heads with Lead Overlaid Structure,” 2000 IEEE.
Tanaka et al., “Design and Fabrication for Sub Half Micron Core Width Spin Valve Read Head,” 2000 IEEE.
S.H.Liao et al. ,88-04. “A Study on the Extendability of Spin Valve Heads for High Density Recording”.

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