Lead plating method for GMR head manufacture

Details Lead plating method for GMR head manufacture Lead plating method for GMR head manufacture

2005-12-13

2005-12-13

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603070, C029S603150, C029S603160, C029S603180, C205S119000, C205S122000, C360S234100, C360S324110, C360S324120, C360S324200, C427S127000, C427S128000, C438S369000, C438S396000, C438S706000, C438S720000, C438S722000, C451S005000, C451S041000

Reexamination Certificate

active

06973712

ABSTRACT:
A major problem in Lead Overlay design for GMR structures is that the magnetic read track width is wider than the physical read track width. This is due to high interfacial resistance between the leads and the GMR layer which is an unavoidable side effect of prior art methods. The present invention uses electroplating preceded by a wet etch to fabricate the leads. This approach requires only a thin protection layer over the GMR layer to ensure that interface resistance is minimal. Using wet surface cleaning avoids sputtering defects and plating is compatible with this so the cleaned surface is preserved Only a single lithography step is needed to define the track since there is no re-deposition involved.

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