Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1997-04-07
1998-09-08
Whitehead, Carl W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257676, 257776, H01L 23495
Patent
active
058048715
ABSTRACT:
Along the column of bonding pad (1), bidding terminal portions (2c), (3c), (4a), (5a) of bus bars (2), (3), and signal lines (4), (5) are arranged; principal wiring portions (2a), (3a) are made to extend in a 3-dimensional crossing configuration with respect to the signal lines, and they are connected to the bonding terminal portion of the bus bars, forming the IC package of the LOC type. Between the various bonding terminal portions and the various bonding pads, there exists no main wiring portion of the bus bar. Consequently, bonding wires (6), (7), (8), (9) do not straddle the bus bar principal wiring portion. As a result, when the bonding wire is not elevated, the bonding wire still does not make contact with the bus bar principal wiring portion to cause short circuit; as a result, the reliability is high and the device becomes thinner.
REFERENCES:
patent: 5442233 (1995-08-01), Anjoh et al.
patent: 5545920 (1996-08-01), Russell
patent: 5563443 (1996-10-01), Beng et al.
Patent Abstracts of Japan, vol. 016, No. 045(E-1162), Yaguchi Akihiro, et al., Feb. 1992.
Clark S. V.
Donaldson Richard L.
Kempler William B.
Texas Instruments Incorporated
Whitehead Carl W.
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