Lead on chip semiconductor device and method of fabricating the

Details Lead on chip semiconductor device and method of fabricating the Lead on chip semiconductor device and method of fabricating the

1999-02-26

2000-10-24

Potter, Roy

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

H01L 23495

Patent

active

061371599

ABSTRACT:
The present invention provides a thin, inexpensive, high-performance semiconductor device provided with busbar leads, power leads and signal leads. A portion of the power lead connected to the busbar lead is depressed toward a major surface of a semiconductor chip to form a depressed portion, and the depressed portion is bonded to the major surface of the semiconductor chip by an adhesive layer. The signal lead and the busbar lead are spaced apart from the major surface of the semiconductor chip.

REFERENCES:
patent: 5821605 (1998-10-01), Hong et al.

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