Lead, method of assembling an integrated circuit device, integra

Details Lead, method of assembling an integrated circuit device, integra Lead, method of assembling an integrated circuit device, integra

1993-06-22

1995-10-24

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228204, 174 524, 174260, 174 94R, 361773, H05K 334

Patent

active

054603196

ABSTRACT:
A lead for achieving solder joining with great vibration strength includes an upper lead portion having a clip and a lower lead portion having a thin tip for insertion into an electrode in a lower substrate and an oblong through hole in the body of the lower lead portion for inducing capillarity of soldering flux.

REFERENCES:
patent: 3541225 (1970-11-01), Raciti
patent: 4257668 (1981-03-01), Ellis, Jr.
patent: 4478364 (1984-10-01), Ditzig
patent: 4647126 (1987-03-01), Sobota
patent: 4656442 (1987-04-01), Hayakawa
patent: 4991059 (1991-02-01), Kiyose
patent: 5096425 (1992-03-01), Takahashi
patent: 5177326 (1993-01-01), Goldhammer
patent: 5241134 (1993-08-01), Yoo
patent: 5270492 (1993-12-01), Fukui

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