Lead material for electronic part, lead and semiconductor device

Details Lead material for electronic part, lead and semiconductor device Lead material for electronic part, lead and semiconductor device

1997-12-09

2000-08-29

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428646, 257772, H01V 2348, B32B 1501

Patent

active

061106089

ABSTRACT:
A lead material for an electronic part having no adverse effect on the environment, having excellent solderability, desirable welding strength during welding and a low degree of nonuniform thickness of the plated layer during reflow processing. The lead material has a first plated layer and a second plated layer, both of which do not contain Pb, laminated on the surface of a conductive substrate in such order. The melting point of the second plated layer is lower than that of the first plated layer. The first and second plated layers are made of a Sn substance and a Sn alloy, respectively or vice versa.

REFERENCES:
patent: 3162512 (1964-12-01), Robinson
patent: 4014660 (1977-03-01), Schreiner et al.
patent: 4441118 (1984-04-01), Fister et al.
patent: 4830933 (1989-05-01), Hodes et al.
patent: 5808853 (1998-09-01), Dalal et al.

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