Lead material for ceramic package IC

Details Lead material for ceramic package IC Lead material for ceramic package IC

1986-01-07

1987-08-18

Dean, R.

Alloys or metallic compositions

Copper base

Zinc containing

420471, 420472, 420473, 420479, C22C 904

Patent

active

046876332

ABSTRACT:
A lead material for ceramic package ICs which comprises Ni 1.0-5.0 wt %, Co 0.2-1.0 wt %, Si 0.2-1.5 wt %, Zn 0.1-5.0 wt %, Cr 0.001-0.1 wt %, and Mn 0.02-1.0 wt %, with the remainder being Cu and inevitable impurities. It does not cause cracking to the ceramic substrate in the cooling step after silver soldering at 800.degree. to 950.degree. C., even though its coefficient of thermal expansion differs from that of ceramics. Moreover, it retains its high strength and conductivity after brazing.

REFERENCES:
patent: 4366117 (1982-12-01), Tsuji
patent: 4427627 (1984-01-01), Guerlet et al.

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