Geometrical instruments
Patent
1982-07-28
1985-08-27
Weidenfeld, Gil
Geometrical instruments
339275B, H01R 1122, H01R 402
Patent
active
045374619
ABSTRACT:
A solder-bearing lead (10) includes a contact clamping finger (20) having an arcuate, reverse-bent clamping portion (34) which is wrapped about a solder preform (12) so that a surface portion (24) of the preform and an outer end surface portion (22) of the contact finger both directly engage a contact pad (14) on a substrate circuit device (16) when the lead is mounted on the device. When the lead (10) is temporarily subjected to heat in a soldering operation, the solder preform (12) melts and flows directly over the contact pad (14) and then resolidifies to form a soldered connection (28) having the outer end surface portion (22) of the reverse-bent clamping portion (34) of the contact clamping finger (20) embedded in the soldered connection in firm engagement with the contact pad (14).
REFERENCES:
patent: 3351704 (1967-11-01), Sitzler
patent: 3750252 (1973-08-01), Landman
patent: 4019803 (1977-04-01), Schell
patent: 4120558 (1978-10-01), Seidler
patent: 4203648 (1980-05-01), Seidler
patent: 4302067 (1981-11-01), Monson et al.
patent: 4345814 (1982-08-01), Gutbier et al.
patent: 4357069 (1982-11-01), Milora
patent: 4433892 (1984-02-01), Seidler
AT&T - Technologies, Inc.
Bosben D. D.
Paumen Gary F.
Weidenfeld Gil
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