Lead grid array integrated circuit

Details Lead grid array integrated circuit Lead grid array integrated circuit

1992-04-17

1993-05-18

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29739, 29832, 437209, H05K 334

Patent

active

052109399

ABSTRACT:
A method for attaching an array of flexible leads to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.

REFERENCES:
patent: 4689875 (1987-09-01), Solstad
patent: 4751199 (1988-06-01), Phy

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