Lead-free tin-zinc-based soldering alloy

Details Lead-free tin-zinc-based soldering alloy Lead-free tin-zinc-based soldering alloy

1996-07-30

1998-02-17

Ip, Sikyin

Alloys or metallic compositions

Tin base

Copper containing

420561, C22C 1300

Patent

active

057188688

ABSTRACT:
Described is a lead-free tin-zinc-based soldering alloy made up of 7 to 9 wt. % of Zn and 0.1 to 0.5 wt. % of Cu or which further contains not more than 3 wt. % of Bi and, in either case, the balance being Sn except for inevitable impurities. The present invention has made it possible to provide a lead-free soldering alloy which has mechanical properties, such as tensile strength and elongation, comparable with those of conventional Pb--Sn soldering alloys without adding thereto lead which causes environmental pollution, has a melting point not higher than 200.degree. C., which is lower than the heat-resistant temperature of an IC package, and has a low cost.

REFERENCES:
patent: 5491035 (1996-02-01), Carey, II et al.

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