Lead-free tin-silver-based soldering alloy

Details Lead-free tin-silver-based soldering alloy Lead-free tin-silver-based soldering alloy

1998-05-26

1999-11-30

Sheehan, John

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

C22C 1302

Patent

active

059937360

ABSTRACT:
The present invention provides a lead-free tin-silver-based soldering alloy which has a low melting point equal to alloy H without containing harmful lead, expensive In or the like, and has excellent mechanical characteristics, that is, a tensile strength, an elongation value and heat fatigue characteristic as compared with alloy H, and thus, is applicable to soldering work at a low temperature and can make products which have a high reliability and long useful life or durability. The lead-free tin-silver-based soldering alloy consists essentially of Ag: 2 to 4% by weight, Zn: 0.5 to 2% by weight, Bi: 2 to 6% by weight, and the balance being substantially Sn.

REFERENCES:
patent: 5762866 (1998-01-01), Jin et al.
English language abstract of Japanese Patent Document No. JP408206874A, Aug. 1996.

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