Lead-free soldering material having superior solderability

Details Lead-free soldering material having superior solderability Lead-free soldering material having superior solderability

1995-10-11

1998-12-01

Ip, Sikyin

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

148 22, 148 23, C22C 1300, B23K 3526

Patent

active

058433716

ABSTRACT:
A lead-free soldering material for soldering wires of electronic parts is disclosed. The lead-free soldering material is composed of in weight %: 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn, and the soldering material shows a superior solderability.

REFERENCES:
patent: 5256370 (1993-10-01), Slattery et al.
"Evaluation of Lead-Free Solder Joints in Electronic Assemblies," by Artaki and A.M. Jackson, Journal of Electronic Materials, vol. 23, No. 8, 1994.
"New, Lead-Free Solders," by M. McCormack and S. Jin, Journal of Electronic Materials, vol. 23, No. 7, 1994.

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