Lead-free solder paste for reflow soldering

Details Lead-free solder paste for reflow soldering Lead-free solder paste for reflow soldering

2005-05-24

2005-05-24

Cooke, Colleen P. (Department: 1754)

Metal fusion bonding

Process

Plural joints

C228S248100

Reexamination Certificate

active

06896172

ABSTRACT:
A lead-free solder paste suitable for reflow soldering includes a plurality of different types of metal powder mixed with a flux. One of the metal powders is a Sn alloy powder. Another of the metal powders is selected from a Sn alloy powder, elemental Ag powder, elemental Cu powder, and elemental Sn powder. Each Sn alloy powder includes 0-8 mass % of Ag, 0-5 mass % of Cu, and at least 80 mass % of Sn. The plurality of metal powders have a composition when melted of 1-5 mass % Ag, 0.5-3 mass % Cu, and a remainder of Sn.

REFERENCES:
patent: 4695428 (1987-09-01), Ballentine et al.
patent: 4758407 (1988-07-01), Ballentine et al.
patent: 4778733 (1988-10-01), Lubrano et al.
patent: 4879096 (1989-11-01), Naton
patent: 5229070 (1993-07-01), Melton et al.
patent: 5328521 (1994-07-01), Keusseyan
patent: 5352407 (1994-10-01), Seelig et al.
patent: 5382300 (1995-01-01), Blonder et al.
patent: 5393489 (1995-02-01), Gonya et al.
patent: 5405577 (1995-04-01), Seelig et al.
patent: 5427865 (1995-06-01), Mullen et al.
patent: 5435968 (1995-07-01), Panthofer
patent: 5527628 (1996-06-01), Anderson et al.
patent: 5540379 (1996-07-01), Kazem-Goudarzi et al.
patent: 5573602 (1996-11-01), Banerji et al.
patent: 5698160 (1997-12-01), Chen et al.
patent: 5863493 (1999-01-01), Achari et al.
patent: 5918795 (1999-07-01), Yamaguchi et al.
patent: 5928404 (1999-07-01), Paruchuri et al.
patent: 5938862 (1999-08-01), Yeh et al.
patent: 6077477 (2000-06-01), Sakai et al.
patent: 6156132 (2000-12-01), Yamashita et al.
patent: 6179935 (2001-01-01), Yamashita et al.
patent: 6228322 (2001-05-01), Takeda et al.
patent: 6231691 (2001-05-01), Anderson et al.
patent: 6241942 (2001-06-01), Murata et al.
patent: 6267823 (2001-07-01), Yamaguchi et al.
patent: 6334570 (2002-01-01), Koshi et al.
patent: 6360939 (2002-03-01), Paruchuri et al.
patent: 3027441 (1993-03-01), None
patent: 3027441 (1993-03-01), None
patent: 09295182 (1997-11-01), None
patent: 09295182 (1997-11-01), None
patent: 11138292 (1999-05-01), None
patent: 11138292 (1999-05-01), None
patent: 11186712 (1999-07-01), None
patent: 11186712 (1999-09-01), None
patent: 9709455 (1997-03-01), None
patent: WO 9709455 (1997-03-01), None
Laine-Ylijoki et al. “Development and Validation of a Lead-Free Alloy for Solder Paste Applications”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part C, vol. 20, No 3, Jul. 1997, pp. 194-198.*
Laine-Ylijoki et al, “Develoment and Validation of a Lead-Free Alloy for Solder Paste Applications”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part C, vol. 20, No. 3, Jul. 1997, pp. 194-198.

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