Lead-free solder compositions

Details Lead-free solder compositions Lead-free solder compositions

1996-12-16

1999-01-26

Ip, Sikyin

Alloys or metallic compositions

Tin base

420560, 420561, 420562, 148400, C22C 1300

Patent

active

058634932

ABSTRACT:
Electrical solder compositions (by weight percent) having between 91.5-96.5% Sn; 2-5% Ag; 0.1-3% Ni; and 0-2.9% Cu; and having a melting temperature 220.degree. C. or less. The solder compositions have microstructure with uniformly dispersed fine grains of Sn--Ni, Sn--Cu and Sn--Cu--Ni intermetallic phases that provide resistance to grain growth during thermal cycling.

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