Lead-free solder balls and method for the production thereof

Details Lead-free solder balls and method for the production thereof Lead-free solder balls and method for the production thereof

2004-10-13

2008-09-16

Ip, Sikyin (Department: 1793)

Alloys or metallic compositions

Tin base

Copper containing

C148S400000, C075S340000

Reexamination Certificate

active

07425299

ABSTRACT:
Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.

REFERENCES:
patent: 5445666 (1995-08-01), Peschka et al.
patent: 5653783 (1997-08-01), Ohzeki
patent: 6517602 (2003-02-01), Sato et al.
patent: 7300606 (1995-11-01), None
patent: 10144718 (1998-05-01), None

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