Lead-free solder and soldered article

Details Lead-free solder and soldered article Lead-free solder and soldered article

2008-09-09

2008-09-09

Ip, Sikyin (Department: 1793)

Alloys or metallic compositions

Tin base

Copper containing

C420S561000, C420S562000, C148S400000, C228S056300

Reexamination Certificate

active

11512304

ABSTRACT:
A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.

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Japanese Examination Reports (3) mailed on Feb. 1, 2005 (w/relevant translation).
Japanese Notice and Submission of Published Document mailed Jun. 8, 2004.
Japanese Examination Report issued Feb. 10, 2004 (w/ English translation of relevant portion).

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