Lead-free solder and soldered article

Details Lead-free solder and soldered article Lead-free solder and soldered article

1999-04-09

2000-10-31

Jones, Deborah

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

174263, 257772, 420560, 420561, 420562, 428644, 428647, 428648, B32B 1501, C22C 1302

Patent

active

061399795

ABSTRACT:
A lead-free solder contains nickel, silver and tin. A soldered article is a workpiece containing a transition metal conductor capable of readily diffusing into melted tin; and the lead-free solder; wherein the lead-free solder is applied and bonded to the workpiece so as to be electrically and mechanically bonded to the transition metal conductor. The lead-free solder and soldered article barely cause electrode erosion during soldering or during aging after soldering, and have high tensile strength and thermal impact resistance.

REFERENCES:
patent: 5837191 (1998-11-01), Gickler
patent: 5863493 (1999-01-01), Achari et al.

Affiliated with

Also associated with

Rating

Lead-free solder and soldered article does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead-free solder and soldered article, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead-free solder and soldered article will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2048941