Lead-free solder, and a lead-free joint

Details Lead-free solder, and a lead-free joint Lead-free solder, and a lead-free joint

2007-05-22

2007-05-22

Zimmerman, John J. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S658000, C420S557000, C420S524000, C228S056300

Reexamination Certificate

active

10532004

ABSTRACT:
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.

REFERENCES:
patent: 2864733 (1958-12-01), Kranich
patent: 5429882 (1995-07-01), Carey, II et al.
patent: 5942185 (1999-08-01), Nakatsuka et al.
patent: 6280858 (2001-08-01), Teshima
patent: 6673310 (2004-01-01), Tadauchi et al.
patent: 6840434 (2005-01-01), Clay et al.
patent: 2004/0091385 (2004-05-01), Leyendecker et al.
patent: 100 45 991 (2002-04-01), None
patent: 55-65341 (1980-05-01), None
patent: 56-69341 (1981-06-01), None
patent: 6-79494 (1994-03-01), None
patent: 6-256922 (1994-09-01), None
patent: 7-96386 (1995-04-01), None
patent: 11-172352 (1999-06-01), None
patent: 11-172353 (1999-06-01), None
patent: 2000-15478 (2000-01-01), None
patent: 2001-121285 (2001-05-01), None
patent: 2001-321983 (2001-11-01), None
patent: 2003-126988 (2003-05-01), None
“Binary Alloy Phase Diagrams”, Second Edition, p. 3417, vol. 3, ASM International, The Materials Information Society, USA.
Brorson et al., “Overview of Solders and Brazes with Reduced Environmental Loading”, 1996, p. 37, AFR Report, Swedish Environmental Protection Agency, Stockholm, Sweden.

Affiliated with

Also associated with

Rating

Lead-free solder, and a lead-free joint does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead-free solder, and a lead-free joint, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead-free solder, and a lead-free joint will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3801291