Lead-free solder alloys

Details Lead-free solder alloys Lead-free solder alloys

1994-08-31

1995-07-04

Simmons, David A.

Metal treatment

Stock

148405, 420562, 420590, C22C 1302

Patent

active

054296897

ABSTRACT:
A non-toxic alloy for soldering electronic components comprising 80% Sn, 5-14.5% In, 4.5-14.5% Bi and 0.5% Ag. The disclosed alloy has a fine microstructure. Particles of intermetallic compounds are finely dispersed throughout the matrix, thereby inhibiting grain growth. Accordingly, the alloy does not significantly coarsen after thermal aging.

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patent: 5256370 (1993-10-01), Slattery et al.
patent: 5328660 (1994-07-01), Gonya et al.
Mei, et al, "Effects of Cooling Rate on Mechanical Properties of Near-Eutectic Tin-Lead Solder Joints," Journal of Electronic Materials, vol. 20, No. 8, 1991, pp. 599-608.

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