Lead-free solder alloy and lead-free solder paste using the...

Details Lead-free solder alloy and lead-free solder paste using the... Lead-free solder alloy and lead-free solder paste using the...

2005-04-26

2005-04-26

Ip, Sikyin (Department: 1742)

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

C148S400000, C148S023000, C420S561000

Reexamination Certificate

active

06884389

ABSTRACT:
Disclosed is a lead-free solder alloy containing 43 to 47% by weight of bismuth, 0.5 to 2.5% by weight of silver, 0.25 to 0.75% by weight of copper, 0.25 to 0.75% by weight of indium, 0.02 to 0.09% by weight of nickel and the balance of tin.

REFERENCES:
patent: 6656291 (2003-12-01), Ueda
patent: 2000-141079 (2000-05-01), None
patent: 2002178191 (2002-06-01), None
Japanese Patent Office Action, titled “Notification of Reasons for Rejection” (2 pages), mailed Oct. 5, 2004 for a counterpart foreign application, and its English translation (2 pages).

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