Lead-free solder alloy and electronic components using it

Details Lead-free solder alloy and electronic components using it Lead-free solder alloy and electronic components using it

2006-02-28

2006-02-28

Ip, Sikyin (Department: 1742)

Alloys or metallic compositions

Tin base

Copper containing

C420S561000, C148S400000

Reexamination Certificate

active

07005106

ABSTRACT:
Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire having an insulating coating, the core wire thereof being copper or a copper alloy, and in which electronic components distances between neighboring terminals are narrow.Electric wire having an insulating coating, the base metal of which is copper, and terminal portions (connection portions) are soldered together by means of a lead-free solder alloy, which contains 3.0 to 5.5 wt % copper (Cu); 0.1 to 0.5 wt % nickel (Ni); and 0.001 to 0.1 wt % germanium (Ge), the remainder of the solder alloy consisting of tin (Sn).

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