Metal treatment – Stock
Reexamination Certificate
2003-09-22
2008-03-04
Ip, Sikyin (Department: 1793)
Metal treatment
Stock
C420S560000, C420S561000
Reexamination Certificate
active
07338567
ABSTRACT:
A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
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Munekata Osamu
Ohnishi Tsukasa
Toyoda Yoshitaka
Ueshima Minoru
Ip Sikyin
Senju Metal Industry Co. Ltd.
Tobias Michael
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