Lead-free solder alloy

Details Lead-free solder alloy Lead-free solder alloy

2008-03-04

2008-03-04

Ip, Sikyin (Department: 1793)

Metal treatment

Stock

C420S560000, C420S561000

Reexamination Certificate

active

10666129

ABSTRACT:
A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

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