Lead-free solder alloy

Details Lead-free solder alloy Lead-free solder alloy

1996-07-05

1998-03-31

Ip, Sikyin

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

420557, B23K 3526, C22C 1300

Patent

active

057335010

ABSTRACT:
A lead-free solder alloy comprises 0.8 to 5.0% inclusive by weight of Ag, not less than 0.1% by weight of In, not less than 0.1% by weight of Bi, the total amount of In and Bi being not more than 17% by weight and the balance of Sn and inevitable impurities. The other lead-free solder alloy further contains 0.1 to 10% by weight of Sb. These solder alloys have low melting point and narrow melting range, and furthermore, they show excellent wettability and mechanical characteristics.

REFERENCES:
patent: 5328660 (1994-07-01), Gonya et al.
patent: 5429689 (1995-07-01), Shangguan et al.
patent: 5435857 (1995-07-01), Han et al.
patent: 5520752 (1996-05-01), Lucey, Jr. et al.

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