Lead-free solder

Details Lead-free solder Lead-free solder

2007-02-06

2007-02-06

Ip, Sikyin (Department: 1742)

Alloys or metallic compositions

Tin base

Copper containing

C420S561000, C148S400000

Reexamination Certificate

active

10682305

ABSTRACT:
A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and has a liquidus temperature of 420° C. or below. The solder may further comprise at least one oxidation-inhibiting element selected from the group consisting of P, Ge, and Ga in a total amount of 0.001–0.5 mass %, and/or Ag in an amount of 0.05–2 mass % as a wettability-improving element.

REFERENCES:
patent: 2002/0127136 (2002-09-01), Takaoka et al
patent: 1213089 (2002-06-01), None
patent: 55020403 (1980-02-01), None
patent: 11216591 (1999-08-01), None
patent: 2001121286 (2001-05-01), None
patent: 2001205476 (2001-07-01), None
patent: 2001334384 (2001-12-01), None

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