Lead-free solder

Details Lead-free solder Lead-free solder

1996-09-13

1997-08-19

Ip, Sikyin

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

420557, 148 22, C22C 1302

Patent

active

056585284

ABSTRACT:
A lead-free solder consisting of 1 to 4 wt % of Ag, at least one of Bi and In in respective amounts meeting the conditions that the value of expression (1), A, is equal to or greater than 5.00 and that the value of expression (2), B, is equal to or less than 6.90, and Sn for the balance:

REFERENCES:
patent: 5256370 (1993-10-01), Slattery et al.
patent: 5328660 (1994-07-01), Gonya et al.
patent: 5393489 (1995-02-01), Gonya et al.
Artaki, I. and Jackson, A.M., Evaluation of Lead-Free Solder Joints in Electronic Assemblies, Journal of Electronic Materials, vol. 23, No. 8, Aug. 1994.

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