Lead-free solder

Details Lead-free solder Lead-free solder

1996-10-22

1998-11-17

Ip, Sikyin

Alloys or metallic compositions

Tin base

Copper containing

420561, 420562, C22C 1300

Patent

active

058371915

ABSTRACT:
A lead-free solder pursuant to the invention consists essentially of, in weight %, about 0.75% to about 2% antimony, about 0.05% to about 0.6% copper, about 0.05% to about 0.6% silver, about 0.05% to about 0.6% nickel and balance essentially tin. An even more preferred solder consists essentially of, in weight %, about 0.8% to about 1.8% antimony, about 0.05% to about 0.15% copper, about 0.05% to about 0.15% silver, about 0.05% to about 0.15% nickel and balance essentially tin.

REFERENCES:
patent: 4695428 (1987-09-01), Ballentine et al.
patent: 4758407 (1988-07-01), Ballentine et al.
patent: 4778733 (1988-10-01), Labrano et al.
patent: 5352407 (1994-10-01), Seelig et al.
patent: 5405577 (1995-04-01), Seelig et al.
patent: 5527628 (1996-06-01), Anderson et al.

Affiliated with

Also associated with

Rating

Lead-free solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead-free solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead-free solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-881048