Lead-free, low-temperature solder compositions

Details Lead-free, low-temperature solder compositions Lead-free, low-temperature solder compositions

1997-09-26

1998-11-10

Ip, Sikyin

Alloys or metallic compositions

Containing over 50 per cent metal but no base metal

Tin containing

420562, 420577, C22C 3004

Patent

active

058339213

ABSTRACT:
Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133.degree.-167.degree. C. The solders are lead-free and have low melting points making them particularly useful for applications wherein components being joined involve thermoplastic substrates.

REFERENCES:
patent: 3549355 (1970-12-01), Postma
patent: 4806309 (1989-02-01), Tulman
patent: 4879096 (1989-11-01), Naton
patent: 4929423 (1990-05-01), Tucker et al.
patent: 5256370 (1993-10-01), Slattery et al.
patent: 5368814 (1994-11-01), Gonya et al.
patent: 5393489 (1995-02-01), Gonya et al.
patent: 5435857 (1995-07-01), Han et al.
Bady anov, B.N.; Malyugin, M. Yu, "Selection of Solder for Joining of thermoelectric modules," Svar. Proizuod., (1996), (2), 34-35.

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