Alloys or metallic compositions – Containing over 50 per cent metal but no base metal – Tin containing
Patent
1997-09-26
1998-11-10
Ip, Sikyin
Alloys or metallic compositions
Containing over 50 per cent metal but no base metal
Tin containing
420562, 420577, C22C 3004
Patent
active
058339213
ABSTRACT:
Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133.degree.-167.degree. C. The solders are lead-free and have low melting points making them particularly useful for applications wherein components being joined involve thermoplastic substrates.
REFERENCES:
patent: 3549355 (1970-12-01), Postma
patent: 4806309 (1989-02-01), Tulman
patent: 4879096 (1989-11-01), Naton
patent: 4929423 (1990-05-01), Tucker et al.
patent: 5256370 (1993-10-01), Slattery et al.
patent: 5368814 (1994-11-01), Gonya et al.
patent: 5393489 (1995-02-01), Gonya et al.
patent: 5435857 (1995-07-01), Han et al.
Bady anov, B.N.; Malyugin, M. Yu, "Selection of Solder for Joining of thermoelectric modules," Svar. Proizuod., (1996), (2), 34-35.
Paruchuri Mohan R.
Shangguan Dongkai
Ford Motor Company
Ip Sikyin
Melotik Lorraine S.
LandOfFree
Lead-free, low-temperature solder compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lead-free, low-temperature solder compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead-free, low-temperature solder compositions will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1513598