Lead-free low melting solder with improved mechanical properties

Details Lead-free low melting solder with improved mechanical properties Lead-free low melting solder with improved mechanical properties

1994-11-08

1996-10-29

Ip, Sikyin

Alloys or metallic compositions

Tin base

420562, 420577, C22C 1300, C22C 1200

Patent

active

055694330

ABSTRACT:
We have made the surprising discovery that small amounts of Ag below 1% by weight are effective in making Bi--Sn alloys less strain-rate sensitive without deleteriously affecting the melting character of the alloy. A Pb-free solder composition comprising at least 40% by weight Bi, between 40% and 60% Sn, and between 0.05 and 1% Ag is effective to increase the total elongation of the solder by at least 20% under the same processing conditions. Moreover the solder is free of undesirable Ag-containing phases with a melting point in excess of the 183.degree. C. melting point of the Pb--Sn binary eutectic alloy. In a preferred embodiment, the composition comprises 54.75% Bi, 45% Sn, and 0.25 % Ag.

REFERENCES:
patent: 4236922 (1980-12-01), Michl et al.
patent: 5368814 (1994-11-01), Gonya et al.

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