Lead-free glass composites with a low thermal expansion...

Details Lead-free glass composites with a low thermal expansion... Lead-free glass composites with a low thermal expansion...

2011-03-22

2011-03-22

Group, Karl E (Department: 1731)

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

C501S017000, C501S021000, C501S032000, C501S066000

Reexamination Certificate

active

07910506

ABSTRACT:
The glass composite has a linear thermal expansion coefficient α(20-300)of 1.8×10−6K−1to 2.4×10−6K−1, a glass transformation temperature Tg of less than 650° C., and a composition, in weight percent based on oxide content, of: 5-9, B2O3; 1-3, Na2O; 15-22, Al2O3; 61-68, SiO2; 0.2-0.5, K2O; and 5.5-8.5, MgO. It can be made by sintering a mixture of 40 to 60 wt. % of a borosilicate glass powder and 60 to 40 wt. % of a cordierite powder. The powder mixture can be used to make a glass solder for joining parts, to make a sintered body with thermal shock resistance, or for glazing or soldering PZT ceramics.

REFERENCES:
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patent: 1 621 026 (1971-02-01), None
patent: 31 23 600 (1982-03-01), None
patent: 0478971 (1992-04-01), None
patent: 2 080 790 (1982-02-01), None

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