Lead-free copper alloy and a method of manufacture

Metal treatment – Stock – Copper base

Reexamination Certificate

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C420S477000, C420S478000, C420S479000, C420S480000, C420S481000

Reexamination Certificate

active

10788037

ABSTRACT:
A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.

REFERENCES:
patent: 1954003 (1934-04-01), Vaders
patent: 5167726 (1992-12-01), LoIacono et al.
patent: 2002/0057985 (2002-05-01), Ling et al.
patent: 836 567 (1952-05-01), None
patent: 43 18 377 (1993-12-01), None
patent: 100 65 735 (2001-10-01), None
patent: 0 572 959 (1997-02-01), None
patent: 1 031 211 (1953-06-01), None
patent: 350 750 (1931-06-01), None
patent: 09143598 (1997-03-01), None
patent: 11001736 (1999-01-01), None
Patent Abstracts of Japan: JP 09-143598 dated Jun. 3, 1997 (1 page).
Patent Abstracts of Japan: JP 09-316570 dated Dec. 9, 1997 (1 page).

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