Lead-free copper alloy and a method of manufacture

Details Lead-free copper alloy and a method of manufacture Lead-free copper alloy and a method of manufacture

2008-04-08

2008-04-08

Ip, Sikyin (Department: 1793)

Metal treatment

Stock

Copper base

C420S477000, C420S478000, C420S479000, C420S480000, C420S481000

Reexamination Certificate

active

07354489

ABSTRACT:
A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.

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Patent Abstracts of Japan: JP 09-143598 dated Jun. 3, 1997 (1 page).
Patent Abstracts of Japan: JP 09-316570 dated Dec. 9, 1997 (1 page).

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