Lead-free conductive paste

Details Lead-free conductive paste Lead-free conductive paste

1996-05-22

1997-07-08

Lieberman, Paul

Compositions

Electrically conductive or emissive compositions

Metal compound containing

252512, 252513, 252514, 501 32, 501 77, 501 78, H01B 122, H01C 700

Patent

active

056457650

ABSTRACT:
A nontoxic lead-free conductive paste comprising (a) a lead-free glass frit having a crystallization temperature of 700.degree.-870.degree. C. and consisting essentially of, by weight %, 20-38% of SiO.sub.2, 5.5-13.5% of B.sub.2 O.sub.3, 8-15.5% of Al.sub.2 O.sub.3, 4-19% of CaO, 20-29% of ZnO, 0-6% of ZrO.sub.2, 4-16% of TiO.sub.2 and 0.1-3.8% of MoO.sub.3 ; (b) finely divided particles of electrically conductive material; (c) at least one inorganic additive selected from the group consisting of bismuth oxide, zinc oxide-containing containing oxide material, manganese oxide, copper oxide and molybdenum oxide; and (d) an organic medium. The nontoxic conductive paste is free from environmental and health problems and results in conductors having excellent solderability, solder leach resistance, adhesion strength and electrical properties, both on ceramic substrates such as alumina or on dielectric bodies.

REFERENCES:
patent: 4029605 (1977-06-01), Kosiorek
patent: 4420338 (1983-12-01), Ortega
patent: 5376596 (1994-12-01), Tokuda et al.
patent: 5439852 (1995-08-01), Hormadaly
patent: 5518663 (1996-05-01), LaBrancha et al.

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