Lead-free bismuth free tin alloy solder composition

Details Lead-free bismuth free tin alloy solder composition Lead-free bismuth free tin alloy solder composition

1993-04-29

1994-10-04

Roy, Upendra

Alloys or metallic compositions

Tin base

Copper containing

420560, 420562, C22C 1300

Patent

active

053524071

ABSTRACT:
A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 93-98% tin, 1.5-3.5% silver, 0.2-2.0% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-215.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.

REFERENCES:
patent: 3503721 (1970-03-01), Lupfer
patent: 4695428 (1987-09-01), Ballentine et al.
patent: 4758407 (1988-07-01), Ballentine et al.
patent: 4778733 (1988-10-01), Lubrano et al.

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