Lead-free alloys for use in solder bonding

Details Lead-free alloys for use in solder bonding Lead-free alloys for use in solder bonding

1996-08-29

1997-12-16

Andrews, Melvyn

Alloys or metallic compositions

Tin base

420589, C22C 1300

Patent

active

056981600

ABSTRACT:
According to the present invention, an article of manufacture is provided having at least one region which includes a lead-free solder composition. The lead-free solder composition comprises an alloy of at least 50 wt. % tin and 7-30 wt. % zinc. An effective amount of silver is added to increase the ductility of the resultant alloy at least 25% over the ductility of the binary eutectic tin-zinc alloy. In a further embodiment, the present invention provides alloys useful in articles comprising lead-free solder compositions. The alloys include at least (8.0+y) wt. % zinc, 0.25 y to 0.5 y wt. % silver and at least 50 wt. % tin where y is from 0.2 to 22.

REFERENCES:
patent: 4112868 (1978-09-01), Nomaki et al.
patent: 4797328 (1989-01-01), Boehm
patent: 5229070 (1993-07-01), Melton
patent: 5242658 (1993-09-01), Stevens
patent: 5256370 (1993-10-01), Slattery
patent: 5346775 (1994-09-01), Jin et al.
McCormack, M, et al Apl Phys Lett 1994 (Abs) 65(9) pp. 1100-1102.
McCormack M et al J Electron Mater 1994 (Abs) 23(8) pp. 715-720.
McCormack, M. et al Appl Phys Lett 65 (9) pp. 1100-1102 29 Aug. 1994 Significantly Imp Mech Prop in Pbfree SnZnInsolder.

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