Lead-free alloy containing tin, zinc, indium and bismuth

Details Lead-free alloy containing tin, zinc, indium and bismuth Lead-free alloy containing tin, zinc, indium and bismuth

1994-06-22

1995-10-03

Chin, Peter

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

148400, 148405, 420559, 420561, C22C 1302

Patent

active

054550041

ABSTRACT:
A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.

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McCormack and Jin, Progress in the Design of New Lead-Free Solder Alloys, Journal of Metals, pp. 36-40 (Jul. 1993).

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